Precision metal press machining for electronic devices — Lids, caps, and other technologies | Yoshikawa Hi-Precision Kimitsu Factory, Yoshikawa Kogyo Co., Ltd.

Consult with us from the planning stage of new development!Overseas transactions amount to over 50%.We can offer direct sales to overseas customers.

Examples of pression press-machined parts

Accelerating the evolution of electronic devices along with the IoT and 5G industries

YHPC precision press-machined parts are utilized in many internal and external components in IoT-based home appliances and 5G communication devices used in our daily lives, including lids for crystal devices, SAW filters, and sensor devices, as well as actuators for mobile device cameras, cell phone camera modules, and USB type-C connectors. We have the leading global market share for lid products.

About Lids About Caps

We have succeeded at press manufacturing plug casings for globally standard USB type-C connectors, the latest unified connector standard, using progressive dies.

USB type-C connector

Materials: SS316L, others
Possible for single-stage drawing (t 0.15 mm), dual-stage drawing (t 0.17 mm), and prototypes.
U-shaped prototypes can be freely positioned (prototype parts are required).

Smartphone camera lens case: a basic product with a monthly production volume of 10 million units

Camera module yokes and cases

Advanced machining methods that include corner crushing, side machining, burring, and hole machining
Monthly production volume of 10 million units achieved (in FY2019)
We achieve lower costs through progressive press machining that utilizes cam mechanisms.

Exterior case for smartphone-mounted camera, using punching, crushing, and burring.

Cases for camera module actuators

Materials: SPC steel, stainless steel (304, 305, 316L), Cu-based (brass, phosphor bronze, nickel silver, etc.)
Difficult shapes can be produced (irregular shapes, crushing, burring, side-cutting)
Tight tolerances (within ±0.03 of the design value)

Other examples of precision press machining

Vibrating motor cases
Drawn caps for LiDAR
Springs for camera modules
Caps for laser diodes
Drawn caps for MEMS
Carrier tape forming
Lead frames for semiconductors
Connectors
Metal caps with glass
Swaging
Heatsinks
Substrate AuSn plating

A history and track record of producing lids and caps, which are indispensable for ceramic packages.

Lid (left) and stepped lid (right) for crystal devices

Constant advances are being made in the field of electronic devices.
Crystal devices have immeasurable potential, as their usage is expanding to include in-vehicle devices such as self-driving systems and advanced driver-assistance systems (ADAS). We are proud of our history and track record in high-precision press machining technology for products such as lids and caps, which are indispensable for crystal devices.

YHPC’s metalworking technology is also useful for LiDAR cases, which are essential for self-driving vehicles.

Illustration of how self-driving sensing works

LiDAR* is a technology for instantly and accurately sensing people, objects, and other obstacles in the vehicle’s vicinity, using light sensors for detection and distance measurement. It is one of the key safety components of ADAS (advanced driver-assistance systems), which will soon be mainstream and are indispensable for increasingly widespread self-driving vehicles. At Yoshikawa Hi-Precision Kimitsu Factory, we are also developing technology for bonding pressed metal case parts for LiDAR receivers to glass. Sensors are protected by applying high-accuracy precision machining technology during driving in outdoor environments with extreme temperature changes and the effects of vibration. Safe, secure driving is achieved through reliable sensing.

*An acronym for light detection and ranging

About Lids

We’ve achieved the world’s first non-etched press-manufactured stepped lids.

In conjunction with mass production of SMDs for crystal oscillators, Yoshikawa Hi-Precision Kimitsu Factory (hereinafter, YHPC) achieved an industry first in 1989: stepped lids manufactured with presses instead of being etched as had previously been done. These have been adopted in numerous SAW filters, optical devices, and sensor devices, reaching a monthly production volume of 600 million units. YHPC is now widely recognized as being synonymous with lid production.

Monthly volumes of 600 million units!
Nine keywords related to lid production

In addition to its advanced lid-manufacturing technology and expertise, YHPC boasts an impressive mass production track record when it comes to lids for crystal devices, SAW filters, and optical devices. In order to meet the stringent demands of global corporations both in Japan and abroad, we are striving to refine ourselves both in terms of people (engineers and staffers) and facilities (machinery, equipment, and lines).

Facilities and expertise for mass production and ultrasmall products
Highly adhesive metalplating that does not peel even when bent 180°
Our lines focus only on Kovar.
Fully equipped with cleanrooms for thorough elimination of contaminants
Our integrated system covers everything from pressmachining to metal-plating.
Our integrated system covers everything from pressmachining to metal-plating.
World leader with monthly production of 600 million units*³
of our transactions are with international clients.
Prototype delivery times are extremely fast!

*1 The smallest manufacturable size is less than 1 mm.　*2 ISO 14644-1 is “class 7”.　*3 Production volume as of October 2021　*4 Depending on press stock availability

Lid press shapes

Flat lids	Stepped lids	Other


Used for fully automated welding machines with lid positioning functionality. Low cost Board thickness is easily changed (t 0.05 and up).	Used for manual welding machines without lid positioning functionality. Press-machined lids are less expensive than etched. The corner radius can be even smaller than with etched lids.	Lids with shapes to enable positioning other than stepped Cavities can be made on the lid side. Material costs are kept in check.

Burr-less lid processing

Normal	Burr-less light cutting	Burr-less heavy cutting
5~15μm	0~3μm	0μm
Low cost Top and bottom surfaces different High incidence of metal foreign substance generation	Small shear droop Practically no difference between top and bottom surfaces	Large shear droop Practically no incidence of metal dust generation

About Caps

We have combined our drawing technologies to increase internal volume and lower costs.

Caps are metal components with a “drawn shape” for the purpose of shifting the hollow part of the ceramic package to the underside. The sharp-cornered shape maximizes internal volume while reducing external size to make the component more compact. Mass production using progressive presses has enabled us to lower costs compared to other companies’ drawn caps.

Six keywords about cap production and
our thorough corner radius minimization

When it comes to caps for crystal devices, SAW filters, and optical devices, our press drawing technology can also provide new added value for our customers’ precision drawn products and ceramic package products.

Package cost is reduced by replacing lamination with monolayers.
Ultra-compact design is achieved by putting cavities on the metal side.
Internal radii are minimized with drawn shapes.
Bonding areas can be secured while maintaining compactness.
Flangeless caps provide larger welding surfaces.
Support for Ni and Au metal-plating

Differences in the functionality of generic caps and our own caps

The drawing technology and expertise cultivated since our founding have enabled us to increase internal volume, achieve cap strength and rigidity, and secure bonding surface area. The IC chips and other devices that are encapsulated by our caps can be safely sealed.

Precision Press-Machined Parts